Arıkan PCB Üretim Kriterleri
| Katman Sayısı | 01/01/32 |
| Üretimde Kullanılan Hammaddeler | FR – 4 ( including High Tg 170, High CTI>600V); METALCURE “ALUMINIUM “ PCB based; RO4350, RO4003,RO5870, RO5880, RO6006, RO6010; ARLON, TACONIC, PARK CORP., CERAMIC PCB FR1, CEMI, FR2V0 |
| En Büyük Çalışma Alanı | Flying test: 900*600mm, Fixture test 460*380mm, 1100*600mm No test |
| PCB Hammadde Kalınlığı | 0.20mm–6.00mm |
| Thickness Tol. (T≥0.8mm) | ±8% |
| Thickness Tol. (T0.8mm) | ±10% |
| Insulation Layer Thickness
Yalıtım Tabakası Kalınlığı |
0.075mm–5.00mm |
| Minimum Hat | 0.075mm |
| Minimum Boşluk | 0.075mm |
| Outer Copper Thickness | 35um–420um |
| Inner Copper Thickness | 18um–210um |
| Drill Hole (Mechanical) | 0.15mm–6.35mm |
| Finished Hole (Mechanical) | 0.10mm–6.30mm |
| Diameter Tol. (Mechanical) | 0.075mm |
| Registration (Mechanical) | 0.05mm |
| Solder Mask Type | LPI / UV CURING |
| Minimum Soldermask Bridge | 0.08mm |
| Minimum Soldermask Clearance | 0.05mm |
| Plug via Diameter | 0.25mm–0.60mm |
| Yüzey Kaplama | HASL, HASL LF, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger |